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Operating window for peeling polyimide film

from SPE Plastics Research Online

Polyimide (PI) is a polymeric material whose special structure (aromatic rings with imide groups) gives it superior thermal, mechanical, chemical, and electronic properties and also provides strong resistance for moisture absorption. PI has wide application in the aerospace, military, optical, and electronics industries. The solvent-casting process has served as a vital and efficient tool for producing PI thin films. One of the key issues in this process is that the film must be peeled from the steel belt smoothly and defect-free. Several physical and chemical approaches have been proposed to improve peeling, including using a water bath or air jet or a releasing agent such as hydrofluoric acid. more

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