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New method to enhance heat dissipation in microelectronics

from SPE Plastics Research Online

Effective heat dissipation is vital for improving long-term reliability and avoiding premature failure in microelectronics. Elastomer thermal interface materials are key to this. They are typically made of silicone rubber reinforced with highly thermally conductive but electrically insulating ceramic fillers. However, highly filled SiR/h-BN composite is difficult to process, and the tabular shape and high surface energy of h-BN particles result in poor affinity between the filler particles and SiR. more

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