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IPC NEWS

IPC releases T-50M, terms and definitions for interconnecting and packaging electronic circuits
IPC
This ever evolving standard provides common language of terms and definitions for the electronics industry.
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Emerging and Critical Environmental Product Requirements Conference tour a big hit
IPC
Last week, IPC and ITI hosted three conferences on Emerging and Critical Environmental Product Requirements. More than two hundred representatives of the electronics industry attended the conferences.
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Meet your reliability challenges at IPC Europe Forum: Innovation for Reliability
IPC
Focus on critical high reliability issues, connect with experts and learn about innovations in materials, methodologies and testing, and more at IPC Europe Forum: Innovation for Reliability, October 13-15 in Essen, Germany.
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SPONSORED CONTENT


Join the conversation on how key EU directives and regulations affect your business
IPC
Updates on conflict minerals legislation, the RoHS Directive and other supply chain issues will be provided at IPC Conference on Government Regulation on October 13 in Essen, Germany.
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New IPC report details how PCB manufacturers meet today's technology demands
IPC
IPC’s new survey-based study shows how PCB manufacturers are meeting today's technology demands and looks at the changes expected by 2019 that will affect PCB fabricators and their suppliers of materials and equipment.
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PRODUCT SHOWCASE
  Manage NPDI Costs and Risks
Siemens PLM Software provides NPDI Cost and Risk Management solutions for electronics manufacturers enabling design, development and release of electronics products across the value-chain. Customers use Siemens solutions to manage product cost, portfolios, requirements, compliance, deliverables, IP, and release process. Attend this informative webinar and learn more about NPDI cost and risk management.
 


Submit an abstract or proposal for IPC APEX EXPO 2016
IPC
Submit an abstract for one of the industry’s premier technical conferences or provide a course proposal for one of its largest educational events.
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Strengthen leadership, increase marketability and improve your bottom line
IPC
Get the knowledge you need to enhance your EMS program management skills. IPC EMS Program Management Training and Certification is a three-part, multi-focused educational program for all levels of EMS management that culminates with the valuable CEPM credentials.
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Understanding surface mount component placement
IPC
This video training program covers SMT set up, operation, typical problems and recommended solutions.
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Tech question of the week
IPC
What should the average temperature and humidity level be in an electronic assembly and manufacturing facility?
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  PRODUCT SHOWCASES
Dry Cabinet Bakes at 60C!

AccuAssembly introduces new baking dry cabinets with RH range below 1% RH and temperature up to 60 degree C. Convection heating and fully insulated. Intelligent cabinets are ready for networking, remote tracking and automatic text alarms by cellphone. T60W cabinets come in three sizes and are available from stock.
Improve Manual Stencil Cleaning!

If an ultrasonic stencil cleaner is still on your wish list, 440-R SMT Detergent is the best way to manually clean stencils.

Click here for video demo.

  • Non Hazardous and Non
       flammable
  • No VOCs
  • Mild pleasant odor
  • Safe on all metals and
       plastics
  • Just spray on and wipe off
  • Kolb Cleaning Technologies Stencil Cleaning

    The PS300-2HY is a hybrid stencil cleaner, also suitable for cleaning misprints and solder frames. The PS300-2HY is a fully automatic, single chamber system featuring PowerSpray® technology. The high pressure, high volume pumps disperse cleaning fluid on to the parts to be cleaned. Now capable of cleaning temperatures of 80oC.


    New releases on standards, translations, market research ...
    IPC
    View recently released standards including SM-817A, FC-234A, IPC-A-610F, IPC J-STD-001F, IPC-1071A, IPC-8701, IPC-HDBK-630, and translations; market research documents; multimedia presentations; technical papers and more.
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    Status of standardization: Standards for ballot and final drafts
    IPC
    View IPC documents under development.
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    IPC member milestones
    IPC
    NSWC Crane (Crane, Ind.) recently celebrated its 30th year as an IPC member. See other companies celebrating membership anniversaries.

    New Members
    Invest in your company by joining IPC and experience the membership benefits of the industry’s premier global association. Learn more about IPC membership.

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      FEATURED COMPANIES
    Robotas Mascot ThroughHole Assembly System

    Mascot will improve yields, save time and decrease errors. Mascot provides graphic step-by-step work instructions, delivers the correct component and laser guidance to the placement location.
    MORE
    PACE Process Guides
    Learn basic soldering applications with PACE Process Guides. Browse our 60+ guides available online, each with downloadable PDFs and a 30 second high definition video. MORE


    INDUSTRY NEWS


    Japanese paper art could lead to bending and folding electronics
    Gizmodo
    LG’s G Flex phones are mostly known for their ability to bend slightly under pressure, but someday our mobile devices could be completely rolled up like a piece of paper. And researchers at the University of Michigan are hoping the art of intricate paper cutting might be the secret to that ultimate flexibility.
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    Fitbit raises $732M in the biggest ever consumer electronics IPO
    MobiHealthNews
    This morning San Francisco-based Fitbit debuted its initial public offering on the New York Stock Exchange after increasing the price of its shares to $20 apiece: The IPO raised $732 million, making it the biggest consumer electronics IPO in history, according to Dealogica.
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    Assembly Methods for Printed Circuit Boards
    Advanced Assembly
    Design-for-manufacturing (DFM) is a well known term and an essential part of the design process. Not as well known but just as important is the concept of design-for-assembly (DFA). If you optimize your circuit board so that it is produced flawlessly, yet make it so the board can only be assembled by tedious hand soldering, then you have saved cents per board on manufacturing just to increase the cost by dollars per board on assembly. To avoid this, both the manufacturing and the assembly need to be taken into account during the design phase.
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    Promoted by Advanced Assembly


    Carbon nanoparticles you can make at home
    R&D Magazine
    Researchers have found an easy way to produce carbon nanoparticles that are small enough to evade the body's immune system, reflect light in the near-infrared range for easy detection and carry payloads of pharmaceutical drugs to targeted tissues.
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    Where the jobs are: 2015
    IEEE Spectrum
    This should be a good year for those entering the workforce from college, or midlevel engineers looking to change jobs in the United States. As the U.S. economy continues to grow, American employers plan to hire 9.6 percent more college graduates this year than they did last year, according to the National Association of Colleges and Employers in Bethlehem, Pa. And according to tech recruiting firm Randstad Engineering, in April there were over 130,000 engineering job openings to fill across the country, an average of 17 openings per candidate.
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    The composite properties of rigid vs. multilayer PCBs
    PCBDesign007
    Most materials systems used in PWBs are composites of resins, fabric substrates and metal cladding. Each of these components has its own unique electrical and mechanical properties that contribute to the final characteristics of the finished laminates, prepregs and fabricated multilayer boards.
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    A review of the opportunities and processes for printed electronics
    SMT007
    Printed electronics, also called "plastic electronics," is a new and developing field of interconnect applications that is "related to PCB flexible circuit production." As microsystems continue to move towards higher speed and microminiaturization, the demands for interconnection are opening up new opportunities for "innovative" interconnects.
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    IPC CALENDAR

    Date Event Location
    September 9-11 IPC India Pavilion at electronica India / productronica India 2015 New Delhi, India
    September 27-October 1 IPC Fall Standards Development Committee Meetings
    co-located with SMTA International
    Rosemont, Illinois
    October 25-26 IPC Technical Education
    DFX-Design For Excellence (DFM, DFA, DFT and more)
    Best Practices in Fabrication
    Advanced Troubleshooting
    SMT Problem Solving
    Minneapolis
    December 2-3 IPC Technical Education
    DFX-Design For Excellence (DFM, DFA, DFT and more)
    Best Practices in Fabrication
    Advanced Troubleshooting
    SMT Problem Solving
    Raleigh, N.C.


     



    IPC Global Insight
    Colby Horton, Vice President of Publishing, 469.420.2601
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    Natalie Rodriguez, Senior Content Editor, 469.420.2635 
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