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Text Version   RSS   Subscribe   Unsubscribe   Archive   Media Kit         August 25, 2015

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IPC NEWS

IPC releases IPC-4101D-WAM1, specification for base materials for rigid and multilayer printed boards
IPC
This standard provides key updates for board designers, specifiers of board materials, fabricators and OEMs who use and keep boards current with base materials used in PCBs.
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Court backs companies' free speech over conflict minerals
IPC
The U.S. Court of Appeals for the District of Columbia Circuit declared on August 18 that the U.S. Securities and Exchange Commission (SEC) cannot force public companies to declare whether their products may contain “conflict minerals.”
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IPC global survey reveals top issues of concern for industry executives
IPC
An IPC survey of industry executives titled "What Keeps You Up at Night?" was conducted this summer to identify executives' biggest business problems. The most widely cited concern, as well the one rated as having the highest impact on the respondents' businesses, was demand variability.
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SPONSORED CONTENT


IPC issues technical conference participation call for IPC APEX EXPO 2016
IPC
Submit an abstract for one of the industry’s premier technical conferences or provide a course proposal for one of its largest educational events. Deadline for technical conference paper abstracts extended to: September 14, 2015.
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Congressman Mike Honda tours Juki Automation Systems in California
IPC
On August 18, Congressman Mike Honda (D-Silicon Valley) met with executives and employees of IPC-member company Juki Automation Systems at the company's facility in Fremont, Calif.
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PRODUCT SHOWCASE
  PCB Designer Certification

Introductory Class Video: Enhance your credentials and expertise as a PCB Designer and become an IPC Certified Designer. Taught by industry recognized designers, this program encompasses a variety of topics that relate to the design and development of printed circuit boards. Only from EPTAC.
 


Join IPC's push to evolve event
IPC
IPC has initiated its own Push to Evolve by changing the way we deliver testing and certification. By evolving to an online process, IPC is improving quality of delivery for testing and certification as well as providing a more secure testing process.
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Connect with global leaders in high-reliability
IPC
Focus on critical high reliability issues, connect with experts and learn about innovations in materials, methodologies and testing, and more at IPC Europe Forum: Innovation for Reliability, October 13-15 in Essen, Germany.
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Join the conversation on how key EU directives and regulations affect your business
IPC
Updates on conflict minerals legislation, the RoHS Directive and other supply chain issues will be provided at IPC Conference on Government Regulation on October 13 in Essen, Germany.
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High reliability for medical, military and automotive sectors
IPC
IPC Flexible Circuits – HDI Forum will address challenges associated with Flex and HDI technology with a focus on high-reliability applications, notably in the military-aerospace and medical sectors.
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  PRODUCT SHOWCASES
Dry Cabinet Bakes at 60C!

AccuAssembly introduces new baking dry cabinets with RH range below 1% RH and temperature up to 60 degree C. Convection heating and fully insulated. Intelligent cabinets are ready for networking, remote tracking and automatic text alarms by cellphone. T60W cabinets come in three sizes and are available from stock.
Is your cleaner on the VOC Hit List?

Stencil cleaning has been identified as the SMT assembly process with the highest potential environmental impact! Cleaning chemistries containing VOCs contribute to global warming, smog, potential health issues and are the primary target of increased EPA and OTC regulations. Why wait for the government to force you to change? Click here to see if your cleaner contains VOCs and find a VOC-free cleaner.
Asscon Vapor Phase Reflow

Asscon is an innovative expert in vapor phase technology. All Asscon vapor phase ovens meet today's soldering challenges in an oxygen free, temperature controlled environment. Varying components, board thicknesses and PCB layouts are safely reflowed with guaranteed solder joint integrity. Machines available with or without vacuum for void-free soldering.


The 7 sins of wire harness assembly
IPC
This DVD training program focuses on the most common problems that typically go wrong during the wire harness assembly process — and provides information on how to rectify each transgression.
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Tech question of the week
IPC
What are the pros and cons of LF laminate voids?
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New releases on standards, translations, market research
IPC
View recently released standards including IPC-T-50M, IPC-7801, IPC-A-610F, IPC J-STD-001F, IPC-1071A, IPC-8701, IPC-7092, and translations; market research documents; multimedia presentations; technical papers and more.
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  FEATURED COMPANIES
LadyBird AOI for ThroughHole Assembly

You wouldn’t run your SMT line without AOI; so automate your ThroughHole process with Ladybird AOI. The first dedicated ThroughHole AOI system for defect detection.
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Hepco, Inc.
Electronic Component Lead Cut & Form Equipment and BGA Reballing Systems. info@hepcoblue.com MORE


Status of standardization: Standards for ballot and final drafts
IPC
View IPC documents under development.
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IPC member milestones
IPC
K-Tron Electronics (Pitman, N.J.) recently celebrated its 25th year as an IPC member. See other companies celebrating membership anniversaries.

New Members
Invest in your company by joining IPC and experience the membership benefits of the industry’s premier global association. Learn more about IPC membership.

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INDUSTRY NEWS


Soldering by Hand vs. Machine
Advanced Assembly
Nearly every successful company passes through the difficult transformation of being small to being large. As this transition occurs, there are many product development decisions to be made. For instance, in the past, it was not uncommon for smaller companies and startups to hand solder small quantities of circuit boards in order to fine-tune their PCB designs. As things ramp up and production increased, however, it made sense move to automated machine assembly. Today, it is possible to affordable machine-assemble boards regardless of the product lifecycle phase.
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Promoted by Advanced Assembly


Thermal interface materials enable faster, more efficient electronics
Printed Electronics World
Proper selection of thermal interface materials is crucial for the efficiency of electronic devices, has been proven to reduce the cost of ownership, reduce system power consumption and increase operational lifetime. The IDTechEx Research report Thermal Interface Materials 2015-2025: Status, Opportunities, Market Forecasts finds that this market will be $1.3 billion in 2015, growing to $3 billion in 2025.
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Laser-burned graphene gains metallic powers
R&D Magazine
Rice University chemists who developed a unique form of graphene have found a way to embed metallic nanoparticles that turn the material into a useful catalyst for fuel cells and other applications. Laser-induced graphene, created by the Rice lab of chemist James Tour last year, is a flexible film with a surface of porous graphene made by exposing a common plastic known as polyimide to a commercial laser-scribing beam.
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Visual search next opportunity for electronics components industry
EBN
Few visual search engines today, if any, can identify the details in electronic components, though several engine options, such as EyesFinder, Blippar, Snap36, and VizSeek, have emerged. Some will no doubt give it a try. Retailers also have begun integrating visual search into their apps. The more sophisticated ones base the technology on artificial neural networks.
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Taking hold: Adhesives tackle multiple materials
DesignNews
Multiple materials are now common in aerospace and automotive assemblies, and they’re showing up in consumer electronics and medical devices. Fastening them together has been a major dilemma. Outside of specialized aerospace and automotive designs, very few fasteners can do the job reliably. But adhesive makers are stepping up to the challenge.
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IPC CALENDAR

Date Event Location
September 9-11 IPC India Pavilion at electronica India / productronica India 2015 New Delhi, India
September 27-October 1 IPC Fall Standards Development Committee Meetings
co-located with SMTA International
Rosemont, Illinois
October 13 IPC Conference on Government Regulation Essen, Germany
October 13 –15 IPC Europe Forum: Innovation for Reliability Essen, Germany
October 28 – 30 IPC Flexible Circuits-HDI Forum Minneapolis, Minnesota
October 26-27 IPC Technical Education
DFX-Design For Excellence (DFM, DFA, DFT and more)
Best Practices in Fabrication
Advanced Troubleshooting
SMT Problem Solving
Minneapolis, Minnesota
December 2-3 IPC Technical Education
DFX-Design For Excellence (DFM, DFA, DFT and more)
Best Practices in Fabrication
Advanced Troubleshooting
SMT Problem Solving
Raleigh, N.C.


 



IPC Global Insight
Colby Horton, Vice President of Publishing, 469.420.2601
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Natalie Rodriguez, Senior Content Editor, 469.420.2635 
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