New method to enhance heat dissipation in microelectronics
from SPE Plastics Research Online
Effective heat dissipation is vital for improving long-term reliability and avoiding premature failure in microelectronics. Elastomer thermal interface materials are key to this. They are typically made of silicone rubber reinforced with highly thermally conductive but electrically insulating ceramic fillers. Hexagonal boron nitride has high thermal conductivity and high electrical resistivity, which make it an ideal candidate for such a filler.
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