New Fujitsu heat pipe technology could cool your next smartphone
One of the basic technologies that modern PCs rely on for CPU and GPU cooling may be making its way to mobile devices, thanks to pioneering work from Fujitsu Laboratories. The organization claims its new design can transfer 5x more heat than existing thin heat pipes, all while adding less than a millimeter to device thickness. The technology could be useful in balancing higher performance devices with their inevitable temperature increases.
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