Bosch to exhibit 2-in-1 biscuit system at Pack Expo
from Packaging Europe
Following a highly successful field test with leading international manufacturer of biscuits and cakes United Biscuits, Bosch Packaging Technology for the first time will showcase its innovative Two-in-One biscuit packaging system to the North American market at PACK EXPO Las Vegas 2015. Launched at Interpack 2014, it is the first system of its kind capable of pack style changeovers from slug to pile packs in less than three minutes, offering unprecedented flexibility to biscuit manufacturers.
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